Description
- Excellent for use through hot runner systems
- Safe to purge through the mold
- Safe to purge through the mold
- Helps eliminate color streaking and black specs
- Chemically reactive compound
- Polyolefin resin carrier
- GRAS rated active ingredients safe for food packaging applications
KLENZ is a revolutionary purging compound requiring no mixing or preparation time. With operating temperatures of 330 – 610 degrees F / 165 – 321 degrees C. KLENZ thoroughly cleanses hot runners and the barrel, helping to eliminate color dtreaking and black specs. Formulated with a polylefin resin carrier, KLENZ purging copound is safe to purge right through the mold, saving time, material and money. All ingredients are GAS rated so it is safe to use for food packaging applications. For use with ijection molding, extrusion and blow molding.
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